2016

• Routability in 3D IC Design: Monolithic 3D vs. Skybridge 3D CMOS

  JiaJun Shi, Mingyu Li, Santosh Khasanvis, Mostafizur Rahman, Csaba Andras Moritz
  in Proceedings of IEEE/ACM International Symposium on Nanoscale Architectures (NanoArch) , 145-150 , 2016 , PDF

• Towards Automatic Thermal Network Extraction in 3D ICs

  Mingyu Li, JiaJun Shi, Mostafizur Rahman, Santosh Khasanvis, Sachin Bhat, Csaba Andras Moritz
  in Proceedings of IEEE/ACM International Symposium on Nanoscale Architectures (NanoArch) , in press , 2016 , PDF

• On the Design of Ultra-High Density 14nm Finfet Based Transistor-Level Monolithic 3D ICs

  JiaJun Shi, Deepak Nayak , Motoi Ichihashi, Srinivasa Banna, Csaba Andras Moritz
  IEEE Computer Society Annual Symposium on VLSI , pp. 449 - 454 , 2016 , PDF

• Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology

  Mingyu Li, JiaJun Shi, Mostafizur Rahman, Santosh Khasanvis, Sachin Bhat, Csaba Andras Moritz
  IEEE Computer Society Annual Symposium on VLSI , 403-408 , 2016 , PDF

• A 14nm FinFET transistor-level 3D partitioning design to enable high-performance and low-cost monolithic 3D IC

  JiaJun Shi, Deepak Nayak , Srinivasa Banna, Robert Fox, Srikanth Samavedam, Sandeep Samal, Sung Kyu Lim
  IEEE International Electron Devices Meeting (IEDM) , 2.5.1 - 2.5.4 , 2016 , PDF